January 20, 2021 3:03 am

NXP signs MoU with HCL to expand VLSI and ecosystem in India

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The semiconductor firm India has signed Memorandum of Understanding (MoU) with Technologies for next-gen advanced electronics and semiconductor products development.

Both the firm stressed that the MoU signifies a strong technology collaboration between the two technology giants to co-develop the automotive product family for global automotive customers.

“Considering the transformations taking place in the industry, this MOU will be a win-win situation for both the companies, speeding up the semiconductor development and time to market,” said Sanjay Gupta, Vice-President & India Country Manager, NXP India.

“With the joint expertise, we would be able to solve the roadblocks swiftly and quickly to develop meaningful solutions in the areas of advanced automated connected cars and low power IOT applications to expand the Indian semiconductor ecosystem,” Gupta said

“In line with the Indian government’s ‘Skill India’ initiative, this partnership will help in enhancing the product development skills of Indian engineers and they will get the opportunity to work on high-tech projects within the country”, he added.

NXP, with over 2,500 engineers in India, is involved in development of semiconductor hardware and software designs for the embedded market in various application segments like automotive, security & connectivity, digital networking and next generation technological departments.

The company claimed that for providing safe and secure mobility, it has developed advanced driver assistance systems (ADAS) that aid drivers and help prevent accidents by leveraging technologies like radar, V2X (vehicle-to-everything communication) and lidar to perform functions like blind-spot monitoring, lane departure warning and parking assistance.

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