Tooba Aslam is a Correspondent at Tech Observer Magazine, covering startups, industry and advertising and marketing. With a degree in marketing, she brings a balanced perspective to reporting on innovation and market trends.
The government launched Samadhan Didi, an AI voice chatbot that lets citizens file grievances by speaking in their own language. The tool automatically routes complaints to the correct ministry.
The CCPA has fined Vajiram and Ravi ₹7 lakh for misleading UPSC coaching advertisements. The regulator found 258 of 413 claimed toppers had enrolled only in a free interview programme after clearing earlier stages independently.
India's data centre capacity is projected to grow from 1.5 GW to 6.5 GW by 2030, creating nearly one lakh engineering jobs in AI, cooling technologies and digital infrastructure, Union minister Jitendra Singh said.
As artificial intelligence moves into Indian workplaces, farms and creative studios, technology leaders say the harder question is no longer adoption speed but whether users can trust these systems.
On National Technology Day 2026, technology executives warn that India's AI leadership depends not on adoption speed but on building trusted data, cyber resilience and user-centric systems.
Dhananjay Ganjoo has returned to F5 as country manager for India and SAARC, two years after the company described his departure as a retirement. He will lead F5's regional growth strategy and AI-ready application security push.
The Centre has launched the Swasth Bharat Portal to integrate India's fragmented digital health systems. The platform aims to reduce duplicate data entry and cut infrastructure costs by up to 30 per cent.
MeitY dismissed reports claiming Aadhaar cards would soon display only a photograph and QR code. The ministry said no such proposal exists and advised citizens to rely only on official UIDAI communication.
Motorola has launched the edge 70 pro in India at an effective starting price of ₹36,999, featuring a 50MP Sony LYTIA 710 camera sensor with AI-powered low-light photography capabilities.
India's first advanced 3D chip packaging facility will come up in Bhubaneswar with a ₹2,000 crore investment. The plant will produce 70,000 glass panels and 50 million assembled units annually.