Key Points
- Cabinet approved Semicon 2.0 on 15 July 2026 with ₹1.275 lakh crore outlay
- Over 1 lakh engineers trained through NIELIT Calicut SMART Lab programme
- 68,000 persons trained in chip design with 175 designs taped out at SCL Mohali
The Union Cabinet has approved Semicon 2.0 with an outlay of ₹1.275 lakh crore to address India’s semiconductor manufacturing and talent development needs, minister of state for electronics and information technology Jitin Prasada informed the Lok Sabha on Thursday.
The programme includes dedicated funding for research in advanced technologies and for building a workforce capable of supporting the entire semiconductor value chain, from chip design and fabrication to assembly, testing, marking and packaging, known as ATMP.
Prasada’s statement stressed that government initiatives have already trained over 1 lakh engineers and 68,000 persons in chip design. A total of 175 chip designs have been taped out, the final stage before manufacturing, from the Semiconductor Complex at Mohali.
The Chips to Startup programme, known as C2S, has provided access to electronic design automation tools, the specialised software used to design integrated circuits, at no cost to engineering institutions. Usage of these tools has exceeded 240 lakh hours across participating colleges and universities.
In Tamil Nadu alone, 61 institutions are supported under the programme, including the Indian Institute of Technology Madras, the National Institute of Technology Tiruchirappalli and Anna University’s College of Engineering Guindy in Chennai.
A Skilled Manpower Advanced Research and Training Lab at NIELIT Calicut has trained more than 1 lakh candidates in very large scale integration (VLSI) design, embedded systems and the internet of things. VLSI refers to the process of creating integrated circuits by combining thousands of transistors into a single chip.
The Ministry of Electronics and Information Technology has approved a project to establish a semiconductor assembly and testing laboratory at NIELIT Guwahati. The facility will support the growing ATMP ecosystem, particularly upcoming manufacturing initiatives in the North-Eastern region.
India Semiconductor Mission has partnered with Lam Research, a US-based semiconductor equipment manufacturer, for a large-scale training programme in nanofabrication and process-engineering. The programme aims to train 60,000 persons over 10 years in skills required for ATMP and advanced packaging, where multiple chip components are integrated into a single package.
Under the FutureSkills PRIME programme, implemented by MeitY in partnership with Nasscom, online courses are available for skilling in emerging technologies including semiconductors. The portal offers certificates aligned with industry requirements.
A memorandum of understanding between India Semiconductor Mission and NAMTECH, a consortium of technical institutions, aims to train approximately 5,000 professionals over five years. The agreement includes structured certification programmes with national and international recognition, faculty exchange and internship opportunities at fabrication units, ATMP facilities and design houses.
A separate agreement with IBM establishes a semiconductor research centre in India focusing on research and development, intellectual property sharing, chip prototyping and innovation across advanced semiconductor technologies.
India Semiconductor Mission has signed agreements with Purdue University and Arizona State University in the United States. The Purdue partnership aims to establish the university as a flagship academic collaborator for workforce development and joint research in semiconductors and microelectronics.
By the numbers
- ₹1.275 lakh crore
- Semicon 2.0 programme outlay
- 1 lakh+
- Engineers trained at NIELIT Calicut
- 60,000
- Target workforce from Lam Research partnership
The Arizona State University agreement supports India’s semiconductor ecosystem through academic exchange, joint research and institutional partnerships contributing to workforce development.
Based on recommendations from a committee comprising representatives from the semiconductor industry, academia and government, the All India Council for Technical Education has launched new curricula for undergraduate degrees, diplomas and minor degrees in semiconductor domains.
The Semicon India Future Skills Talent Committee submitted its report with a roadmap and targets for positioning India as a semiconductor talent nation. AICTE’s curriculum changes aim to create a larger talent pool for the sector.
Your Questions, Answered
What is Semicon 2.0 and how much has the government allocated?
Semicon 2.0 is the government's updated semiconductor programme approved by the Union Cabinet on 15 July 2026 with an outlay of ₹1.275 lakh crore. It includes dedicated funding for research in advanced technologies and talent development across chip design and manufacturing.
How many engineers has the government trained in semiconductors so far?
Over 1 lakh engineers have been trained through the SMART Lab at NIELIT Calicut in VLSI, embedded systems and IoT. Additionally, 68,000 persons have been trained in chip design, with 175 designs taped out from SCL Mohali.
What is the Chips to Startup programme?
The Chips to Startup or C2S programme provides free access to electronic design automation tools to engineering institutions. Usage has exceeded 240 lakh hours across participating colleges, with 61 institutions supported in Tamil Nadu alone.
What partnerships has India Semiconductor Mission signed for training?
India Semiconductor Mission has signed agreements with Lam Research to train 60,000 persons over 10 years, NAMTECH to train 5,000 professionals over five years, IBM to establish a research centre, and Purdue University and Arizona State University for academic collaboration.
