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A Digitimes report claims that Apple could cut the die size for its vertical-cavity surface-emitting laser (VCSEL) chips used for 3D Face ID scanning by up to 50 percent.
This would be used in “new iPhone and iPad devices to be rolled out later in 2021″, the report said.
VCSEL is a sensor used to spray infrared dots over a surface to ascertain a 3D depth map.
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The report suggests Apple is reducing the size of the chip used in Face ID only, but the same type of chip is used for LiDAR on the rear of iPhones and iPads.
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India will chair the Common Criteria Development Board from April 2026, gaining influence over international IT security certification standards recognised by 38 countries.