April 14, 2021 10:50 pm
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IIT Madras signs agreement with Applied Materials for research in Artificial Intelligence

Applied Materials deals in materials engineering solutions that used in producing chip and advanced display

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Indian Institute of Technology Madras (IIT Madras) signed a joint development agreement (JDA) with Applied Materials India to conduct research in Data Sciences, Machine Learning and Artificial Intelligence (AI), said a statement. Applied Materials deals in materials engineering solutions that used in producing chip and advanced display. According to tech firm, the industry sectors that can potentially benefit from this initiative are semiconductors, pharma and display.

“We look forward to collaborating with Applied Materials in the fast-expanding field of AI. IIT Madras is already a leader in this area, and bringing the expertise from academics and industry together gives us unique opportunities for making early breakthroughs in applications. IIT Madras strives to stay abreast of developments in technology and welcomes this opportunity to add momentum to its research into AI,” said Prof. Bhaskar Ramamurthi, Director, IIT Madras.

The work that will be carried out under the JDA includes research on using representational neural networks and machine learning methods to combine time-series and images for Technology Enabled Software Solutions (TES), advanced image analysis using novel algorithms based on graphics processors or hybrid compute architectures, and evaluation/investigation of an optimal computational environment to develop advanced big using devices such as GPUs, CPUs, FPGAs, hybrid clusters and others.

“Materials engineering innovations are key to achieving the new compute models, chip architectures and materials systems needed to realize the potential of Artificial Intelligence. Applied Materials’collaboration with IIT Madras is focused on the breakthroughs that can accelerate this new era,” said Dr. Om Nalamasu, Senior Vice President and Chief Technology Officer, Applied Materials.

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