December 1, 2020 8:35 pm

Micron starts shipping world’s first 176-layer 3D flash memory

Must Read

How AI monitoring can make your business smarter and better

Artificial Intelligence (AI) makes it feasible for machines to learn from experience, adapt to new inputs, and perform human-like tasks.

Why cybersecurity threats have increased during Covid-19 pandemic

Cybersecurity industry has never had more significant task to carry out than guarding strategic associations and businesses from digital assaults during the coronavirus pandemic

How to choose an effective DDoS mitigation plan

There are several flavours from which to choose when selecting an effective DDoS mitigation strategy. Most enterprises opt for one of the protection flavours (always-on or on-demand)

American semiconductor giant Micron Technology said that it has started shipping world’s first 176-layer 3D NAND which is touted to dramatically improve the application performance across a range of storage use cases spanning , intelligent edge and mobile devices.

The company said that 176-layer triple-level cell 3D NAND is in volume production in its Singapore fab and now shipping to customers, including through its crucial consumer SSD product lines. The company will introduce additional new products based on this technology during calendar 2021.

The company claimed that compared with the previous generation of high-volume 3D NAND, 176-layer NAND improves both read latency and write latency by more than 35%.

“Micron’s 176-layer NAND sets a new bar for the industry, with a layer count that is almost 40% higher than our nearest competitor’s,” said Scott DeBoer, executive vice president of technology and products at Micron.

With new NAND, the company is looking to target a broad array of sectors, including mobile storage, autonomous systems, in-vehicle infotainment, and client and data center solid-state drives (SSDs).

The company said that its new NAND solution offers data transfer rate at 1,600 mega transfers per second (MT/s) on the Open NAND Flash Interface (ONFI) bus, a 33% improvement.

With the slowing of Moore’s Law, Micron said innovation in 3D NAND is critical to ensuring that the industry can keep pace with growing data requirements.

Subscribe to receive the day's headlines from Tech Observer straight in your inbox

Share your views

*The moderation of comments is automated and not cleared manually by techobserver.in. Embedding of any link and use of abusive or unparliamentary language are prohibited.
- Advertisement -

Latest in TECH

Related Articles